IEEE DEIS EIC 2024 Electrical Insulation Conference


 



    Event Details:

  • Date:
  • Location: USA, Minneapolis – Radisson Blu Mall of America
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IEEE DEIS EIC 2024 Electrical Insulation Conference

Minneapolis – Radisson Blu Mall of America
2100 Killebrew Dr, Bloomington, MN 55425

June 2 — 6, 2024

The conference keeps as a target the integration between academia and industry. Technical papers mixing innovative research areas and practical applications related to the several challenges of electrical insulation are to be expected. Exhibitors showing their latest releases, end-users from the utilities and co-ops from the “mid-west” area, and young engineers who can drive from UofM, UW Madison, and the University of Winnipeg will certainly integrate the conference. We expect a massive participation of international attendees, who will count on one of the most modern and highest-ranked airports in the USA, with direct connections from several cities in Europe, Asia, Africa, South America, and Oceania.

The main program of the conference will go from Sunday evening to Wednesday morning, followed by working group meetings in the afternoon and on Thursday. Differently from previous years, the conference opening on Sunday evening will start with a relevant keynote speaker and flow into the expo and a cocktail-style reception. Every conference day will start with a plenary speaker, followed by the presentation of technical papers and poster sessions.

They are preparing a very special session on Wednesday morning. Starting with a discussion panel organized by NEMA around the Impacts of Transportation Electrification on the Electrical Grid, there will be technical sessions on the same topic possibly followed by an IEC working group meeting in the afternoon on the same topic.
Start preparing your papers, as the submission of abstracts will be opened by the end of September. Papers approved and presented during the conference event will be published in the conference proceedings and will become accessible to other readers via IEEEXplore.

 

EIC 2024